Trending...
- LS2 Partners with Angels Of Dirt's "Next Chapter Racer" Series Celebrating Women and Girls in Motorsports
- Everything Policy Unveils Their Classroom Resources Behind Every Policy Topic
- Timbrana Helps General Contractors Improve Jobsite Visibility and Subcontractor Accountability
HARRISBURG, Pa., Feb. 14, 2020 /PRNewswire/ -- TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, will showcase a broad range of data and power connectivity products in booth A17 at the 2020 Open Compute Project (OCP) US Summit March 4-5 at the San Jose Convention Center.
TE is a vertically-integrated supplier delivering high-performance data and power connectivity solutions. The company's products have been incorporated into server, storage, networking and artificial intelligence (AI) products across the OCP show floor. TE will display innovative power solutions along with solutions for internal input/output (I/O), external I/O, board-to-board connectivity, and socket connectivity. TE experts will be on hand to show attendees how these solutions can address a wide variety of applications in next-generation products based on OCP reference designs. TE's showcase will include:
Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver interconnects and STRADA Whisper connector technologies, these solutions can support the performance needed to address next-generation 56G and 112G lanes. TE's high-performance internal interconnects address the needs for high data rates with robust signal integrity and power delivery through mateing/unmateing, including blind-mate service operations commonly found in data center production environments. TE supports jacketed, stranded and sheathed cable solutions to address the bend radius requirements for cable installation and management.
More on The PennZone
External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. The company's solutions not only address the needs for high data rates but can also provide reliable, high-density, compatible solutions for robust interoperability. TE's high-performance cable assemblies can be tailored to support the mechanical and electrical requirements for many applications.
Power solutions: TE's power connectors, cable assemblies and value-added busbar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level busbar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
Board-to-board and socket: High performance board-to-board products address the need for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE's socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects.
More on The PennZone
Learn more and schedule a meeting with one of our experts on TE's 2020 Open Compute Project (OCP) Global Summit events page.
ABOUT TE CONNECTIVITY
TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
Sliver, STRADA Whisper, TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.
SOURCE TE Connectivity
Related Links
www.te.com
TE is a vertically-integrated supplier delivering high-performance data and power connectivity solutions. The company's products have been incorporated into server, storage, networking and artificial intelligence (AI) products across the OCP show floor. TE will display innovative power solutions along with solutions for internal input/output (I/O), external I/O, board-to-board connectivity, and socket connectivity. TE experts will be on hand to show attendees how these solutions can address a wide variety of applications in next-generation products based on OCP reference designs. TE's showcase will include:
Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver interconnects and STRADA Whisper connector technologies, these solutions can support the performance needed to address next-generation 56G and 112G lanes. TE's high-performance internal interconnects address the needs for high data rates with robust signal integrity and power delivery through mateing/unmateing, including blind-mate service operations commonly found in data center production environments. TE supports jacketed, stranded and sheathed cable solutions to address the bend radius requirements for cable installation and management.
More on The PennZone
- Renew Integrative Health Publishes Updated Peptide Therapy Guide to Help Patients Understand Their Options
- Lehigh County Drug and Alcohol Celebrates Grand Opening of Journeys
- Timbrana Addresses the Missing Follow-Through in Commercial Construction Projects
- AI Agents Are Getting Their Own Computers. HRTech Leading in Vertical Harness Development
- UK Financial Ltd Announces Two-for-One Upgrade of Maya 3 to Maya 3G Token Using Chainlink Cross-Chain Technology
External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. The company's solutions not only address the needs for high data rates but can also provide reliable, high-density, compatible solutions for robust interoperability. TE's high-performance cable assemblies can be tailored to support the mechanical and electrical requirements for many applications.
Power solutions: TE's power connectors, cable assemblies and value-added busbar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level busbar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
Board-to-board and socket: High performance board-to-board products address the need for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE's socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects.
More on The PennZone
- JKS Financial Gives Back Through Light of Life Rescue Mission Food Pantry
- Critical FDA Milestone much Closer as Preservative-Free Ketamine Review Advances: NRx Pharmaceuticals (N A S D A Q: NRXP)
- Corner Property Management AAMC Expands Presence with Clover Mill Management Agreement
- Michael Fischer Launches 'Legacy League' Podcast
- Keystone Consulting Engineers Marks Next Chapter of Growth with Refreshed Brand
Learn more and schedule a meeting with one of our experts on TE's 2020 Open Compute Project (OCP) Global Summit events page.
ABOUT TE CONNECTIVITY
TE Connectivity is a $13 billion global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With nearly 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
Sliver, STRADA Whisper, TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.
SOURCE TE Connectivity
Related Links
www.te.com
0 Comments
Latest on The PennZone
- Self-Published Dad's Santa Book Finally Found After 3 Years on Amazon
- Meta Partnership Expanding as Omni One Orders Surge 3X -New Consumer Bundles, Defense Opportunities & AI Robotics: Virtuix Holdings: N A S D A Q: VTIX
- Roots for Boots to Participate in 2026 Adams County Community Foundation Giving Spree
- Timbrana Helps General Contractors Improve Jobsite Visibility and Subcontractor Accountability
- Citizens for West Virginia Election Integrity Urges "FOR" on Amendment 1
- Vegan Kingz Expands Direct-Import Wholesale Lineup to Help Commercial Kitchens Cut Ingredient Costs
- Acuvance Survey Finds ERP Integration Remains a Key Challenge as Healthcare Organizations Prepare for AI
- Everything Policy Unveils Their Classroom Resources Behind Every Policy Topic
- Constantine "Costa" Kapothanasis II Acquires The Lubri-Loy Company, Carrying a 77-Year-Old American Lubricant Brand Into Its Next Era
- LS2 Partners with Angels Of Dirt's "Next Chapter Racer" Series Celebrating Women and Girls in Motorsports
- Danish company biosuite introduces biotech procurement software to track outsourced R&D commitments
- Ten Ten Ten Announces Alento, Its Initiative to Help Independent Primary Care Thrive
- JFAB Consulting to Celebrate New Brand with Private VIP Event at Acrisure Stadium
- Industrial & systems engineering educator and professional to lead global strategic partnerships for professional society
- Convergence of AI, Wearable Technology, Remote Patient Monitoring and Real-World Healthcare: PomDoctor Ltd. (N A S D A Q: POM)
- Timbrana — Construction Project Awareness Software for General Contractors
- Service Guys Urges Ontario Homeowners to Book Chimney Cleaning and WETT Inspections Before the 2026 Heating Season
- WOWX Completes Its Transition from CEX to Decentralized Derivatives Infrastructure
- HSS Medical Supply Celebrates One-Year Anniversary of Its Top Performing Sales Team
- Jacombs Tickets Partners with UEFA to Offer Champions League Tickets