Trending...
- Power Business Solutions Announces Joint Venture with EIG Global Trust to Deliver Data Center Financial Solutions
- Boston Industrial Solutions' Natron® 512N Series UV LED Ink Earns CPSIA Certification
- Roblox and Solsten Alliances; a Stronger Balance Sheet and Accelerated Growth Through AI, Gaming, and Strategic Partnerships for Super League: $SLE
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Outsports announces record-breaking number of LGBTQ+ athletes at 2026 Milan Winter Olympics
- Sheffield Clinic Highlights Safe, Inclusive Laser Hair Removal While Improving Access
- Appliance EMT Partners with Kids Motel Ministry in Metro Atlanta
- CNCPW Divulga Dados de Liquidez do 1º Trimestre: Confirma 100% de Reservas e Atualiza Protocolos de "Saque CNCPW" Contra Fluxos Ilícitos
- Tech Workers Are Escaping "Forever Layoffs" By Becoming Their Own Boss
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- Michael Judkins Releases New Poetry Book, Deeper Than You Think
- Heritage at South Brunswick Celebrates First Home Closing and Strong Sales Momentum
- WinkBeds High-Performance Hybrid Mattresses Debut at Sleep Basil Denver With In-Store Comfort Testing
- Tampa Nonprofit Expands Recovery Services for Men in Crisis With New Farm Program in Plant City
- IYKYK! Coffee Lab Thriving in Huntington Beach, Blending Elevated Coffee, Matcha, Music, and Community
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
Filed Under: Business
0 Comments
Latest on The PennZone
- The Ms. Corporate America Maryland Competition Returns for an Unforgettable Evening of Leadership, Excellence, and Empowerment
- Precision Adult Care Expands 24/7 Adult In-Home Care Services to Meet Growing Demand in the Coachella Valley
- Metavalis Launches Massive Community Coat Drive in Branson to Support Local Residents
- Jim Breuer is Coming to The Eichelberger Performing Arts Center This May
- Peak Exteriors to Expand Its Services to Premium Outdoor Lighting Installation
- Ashley Wineland To Release Fiery Full-length Album "Wineland"
- Robert D. Botticelli Promoted to Century Fasteners Corp. – Director of Sales
- Openchannelflow Wins Web Excellence Award for Outstanding Digital Experience
- STS Capital Partners' Andy Harris Co-Authors 'The Extraordinary Exit,' A Practical Guide for Business Owners Considering a Sale
- One-Click Pro Audio for Streamers: "VoiceSterize" Automates Noise Reduction & Mastering on Mac
- Sole Publishing Announces Essential Parenting Book for Families Navigating the Teen Years
- From Factory Floor to Community Heart: The Rebel Spirit of Wisconsin's Wet Wipe Innovators
- UK Financial Ltd Lists MayaFund (MFUND) ERC-20 Token on CATEX Exchange Ahead of Planned ERC-3643 Upgrade
- Benjamin Ross Group Has Secured Financing for a Company with a Sale Price of $1,050,000
- Denver Apartment Finders Launches Revamped Denver Tech Center Apartment Location Page
- Roblox and Solsten Alliances; a Stronger Balance Sheet and Accelerated Growth Through AI, Gaming, and Strategic Partnerships for Super League: $SLE
- Boston Industrial Solutions' Natron® 512N Series UV LED Ink Earns CPSIA Certification
- Power Business Solutions Announces Joint Venture with EIG Global Trust to Deliver Data Center Financial Solutions
- Scoop Social Co. Partners with Fairmont Hotels & Resorts to Elevate Summer Guest Experiences with Italian Inspired Gelato & Beverage Carts
- Buildout Launches Native Email Marketing Feature, Expanding Its End-to-End CRE Platform