Trending...
- Sara Abbas Receives "Eniochos" Charioteer Award at 2026 Who is Who International Awards
- Detained at 95: South Korea's Prosecution of a Religious Leader Draws International Alarm
- UK Financial Ltd. Opens Test-Phase Maya 3 Liquidity Pool on Uniswap with DEX Screener Visibility for Market-Smoothing Ahead of CATEX Exchange Launch
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Heavy Duty Journal Surpasses 1000 Technical Articles for Diesel Technicians and Fleet Managers
- Brett Furman Launches Ranks Grow
- Philadelphia's Own Reverend Jamie Knight Returns with "Award-Winning Love
- Kolbus Introduces the Next Step in Casemaking Efficiency
- Florida Law Advisers, P.A. Named Best Divorce Firm of 2026 by Expert Law Attorneys
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- Sounds of LA County: 27 Parks.108 Concerts. One County
- Only One Flight Stands Between Los Angeles Youth Leaders and a Life-Saving Mission in South Africa
- Blueshirt Media Joins the Dazos Partner Program, Expanding HIPAA-Compliant AI Admissions Support for Behavioral Health Organizations
- Stigma Across Borders: Concerns Grow Over Discrimination Against Shincheonji Members Abroad
- Roohid Parast, J&J Scientist, Comments on New Psoriasis Biomarker Study
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
Filed Under: Business
0 Comments
Latest on The PennZone
- Socialhose Launches TikTok Investigator, a Platform for Investigating TikTok Live
- David Pedrol named Managing Director in Indonesia
- AutomationIQ Launches to Bring Enterprise-Grade AI Automation to Local and Mid-Market Businesses
- Texas Hospitals & Their Patients Describe Two Very Different Healthcare Systems, New Social Knowing
- DEPIN Studios Sees Surge in Demand After AI Gaming Launch
- Discard Junk Removal Named #1 Junk Removal Company in Sacramento Out of 189 Businesses Evaluated
- J&J Exterminating Mourns the Passing of Founder Bobby John Sr
- Delirious Comedy Club Transforms Into Las Vegas' Newest Live Comedy Studio With Weekly Delirious TV Tapings
- BitTitan Advances MigrationWiz with New Capabilities, Platform Enhancements, and Product Leadership Update
- Sara Abbas Receives "Eniochos" Charioteer Award at 2026 Who is Who International Awards
- Detained at 95: South Korea's Prosecution of a Religious Leader Draws International Alarm
- CCHR: DOJ Takedown Exposes Over $220 Million Defrauded in Behavioral Mental Health Fraud Schemes
- Exeter Smiles Encourages Reading Families to Start Teen Braces This Summer
- ARC Technologies Announces Corporate Asset Sale of buildings, inventory and IP patents
- Lady Liberty Is Coming Home: Historic WWII A-26 Invader Begins Her Final Journey to the Tulsa Air & Space Museum
- The Lashe Announces Limited-Time Sale on Professional Premade Fan Lash Extension Trays
- PropAccount.com Adds Prediction Markets to Its Multi-Asset Prop Firm Platform
- ToyLookup.com Launches AI-Powered Platform to Help Collectors Identify Vintage and Modern Toys
- Rising star Hip-Hop and R&B Force Della Drops Highly Anticipated New Single, "Throw It"
- UK Financial Ltd. Opens Test-Phase Maya 3 Liquidity Pool on Uniswap with DEX Screener Visibility for Market-Smoothing Ahead of CATEX Exchange Launch