Trending...
- Collectibles EvoRelic Celebrates Stellar 4.8-Star Customer Rating
- Pediatrician Launches "Confessions of a Detective Doctor" Children's Book Series
- Brewtay Coffee Partners with Alex's Lemonade Stand to Fuel Penn Wynne Volunteers
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Crosswalk Ministries USA Announces 2026 Child and Family Well-Being Conference in Stockbridge, Georgia
- Autism Podcast Helps Parents Understand Why Behavior Is Communication, Not Defiance
- Filmmaker Preston A. Dent to Premiere "Harrisburg-The Movie" at Whitaker Center for the Arts
- Pollock Begg Family Law Attorneys Earn 2026 Pennsylvania Super Lawyers Honors at Every Level
- Research reveals "The Borderless Pay Standard," a 48-point gap between multinational employers and workers on transparent pay expectations
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- Global.ai Appoints Freedomtech Solutions as Specialist Partner for Agentic AI
- Communities In Schools of Eastern Pennsylvania's Ready, Set, Graduate! Celebrates Over 100 Students in Two Ceremonies
- Lansdowne Photographer Steven Weisz Selected for Philadelphia City Hall Exhibition
- Federal indictments bring new scrutiny to SPLC practices and highlight the real‑world impact of its designations on nonprofit groups, including NCFM
- Shedrack Anderson Releases New Album
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
Filed Under: Business
0 Comments
Latest on The PennZone
- Advanced AI Capabilities Reflected by Upcoming Company Name and Stock Symbol Change for Evolving Pre-Owned Boat Dealer: Off The Hook YS: N Y S E: OTH
- AI-Driven Defense Expansion, Autonomous Systems and Israeli Aerospace Manufacturing Platform: VisionWave Holdings (N A S D A Q: VWAV)
- AI Predicts the Most Likely 2026 FIFA World Cup Winner
- The AI Production Shift: Why Game Development Is Entering Its Most Accelerated Phase
- World-First AI Humanoid Robot Debuts on Cherie Barber's Ground-breaking Australian Reno Show
- New Survey Reveals America's Most Feared Bridges for Cyclists — Golden Gate Tops the List
- Raymond Lavine, Extended Care Benefits Advisor and Author, to Appear on National Television Series Moving America Forward
- NaturismRE Launches Structured Nudism & Naturism Encyclopedia, Aiming to Reframe Public Understanding
- AiBT Advisory Launches AI Deployment Firm for the Mid-Market Companies Big AI Left Behind
- AI Is Closing the Gap Between Offshore Virtual Assistants and Onshore Staff
- CCHR Highlights Concerns Over Coercive and Failed $140 Billion Mental Health Practices at Psychiatric Convention
- Avery Headley Leads Major Stabilization and Modernization Initiative Across Bronx Affordable Housing Portfolio
- NewReputation's AI Sentiment Analysis Tool Reaches 2,500 Users as Businesses Demand Clearer Brand Intelligence
- CAPO Supply Announces Opening of Second Location in New Castle, Pennsylvania
- $224 Billion Growing Market in Life Settlements Presents Major Opportunity for New Policy Acquisition Business Plan: DLT Resolution Stock Symbol: DLTI
- Fyt-02 Launches on Kickstarter The Smart Sensor That Turns Any Chair Into a Posture & Movement Track
- YieldOMega Launches $DOUB Airdrop Campaign Ahead of TimeCurve Launch
- Kaltra Expands Microchannel Water Coil Line for U.S. HVAC Market With New Corrosion-Resistant Tube Technology
- Brewtay Coffee Partners with Alex's Lemonade Stand to Fuel Penn Wynne Volunteers
- White Coat Growth Launches to Help Medical Practices Attract More Patients and Scale with Confidence