Trending...
- Assymetrix Launches the Deepest Independent Prediction Market Data API
- "I'm Sicka Church Too: Give Me Kingdom!" Ignites a Powerful Call for Healing and Truth
- Brian Keenan Joins ALLY Construction Services as Director of Business Development
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Lnk.Bio Becomes the First Link-in-Bio Service Fully Manageable from Inside ChatGPT
- Did Drake Just Find His Next Signee? Peoria Rapper Rhymi Gifts "ICEMANDRAKE" Domains, Drops Debut Album Same Day
- Andrew Tate Says Los Angeles Is "Where I Belong" as He Hints at USA Move
- RAS AP Consulting Advances to Request for Proposal Stage in Heidelberg Materials' SAP Customer & Vendor Master Data Modernization Initiative
- Expert E-Bike Safety Advocate Issues Urgent Warning Following Recent Southern California Fatalities
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- VeneerVibe Releases 2026 Snap-On Veneers Market Report
- David Cavanagh Launches AI SEO Company For ChatGPT And AI Search Visibility
- Matthew Cossolotto Spotlights Make a Promise Day 2026 Events, Including Official Launch of Harness Your PromisePower and Issuing a "Peace Promise"
- Landmark Expands Services to Include Specialized Glass and Glazing Solutions Across Los Angeles
- As Pentagon Releases Ufo Files, Debut Ya Novel Predicted It All
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
Filed Under: Business
0 Comments
Latest on The PennZone
- 5,521 College Athletes Launch Own Merch Stores in Just 30 Days on AthleteMerch.com, Reaching 7,975 Live Storefronts Nationwide
- Altruvest and Financial Executives International Canada Announce Strategic Partnership to Strengthen Nonprofit Boards Across Canada
- Dr. Dee for the People: A Vision of Hope, Healing, and Transformation for Philadelphia
- Free Critical Illness Claim Calculator Launches to the Public
- Best Companies Group Launches Free Best Banks to Work For Program
- I Voted Tvocracy and I Voted Radiocracy
- Tolle Lege Learning Launches Publishing House to Revolutionize Early Learning Initiatives
- HRC Fertility Celebrates Beverly Hills Grand Opening, Spotlighting Fertility Care as Women's Health Month Begins
- HRC Fertility's Dr. Christo G. Zouves Appointed to San Mateo County Medical Association Board of Directors
- HealthBook+ and Stonebrook Risk Solutions Partner to Bring Predictive Intelligence to Healthcare Risk
- Umbrella Becomes First FinOps Platform to Support AWS Billing Transfer Onboarding
- RECYCLEXPERT FZE Strengthens Leadership in Data Destruction UAE and GCC with Certified Secure ITAD Services
- Plasma-Activated Nitric Oxide Cream Outperforms L-Arginine Skincare - New Research Explains Why
- Assymetrix Launches the Deepest Independent Prediction Market Data API
- CCHR: 'Plant-Based' Psychedelics Push Masks Synthetic Drugs and Billion-Dollar Profits
- BTR: i2 Group Launches i2 Amplify, a Community Platform for Intelligence Professionals Worldwide
- L.A. Watts Summer Games Announces Free Pelé Tribute Event at Magic Johnson Park
- SUMOFIBER Fuels Explosive Growth With netElastic vBNG
- Brian Keenan Joins ALLY Construction Services as Director of Business Development
- Burkentine Builders Recognizes Local Fire Departments As Part Of Their Live With Purpose Initiative