Trending...
- Ice Melts. Infrastructure Fails. What Happens to Clean Water?
- The Legal AI Showdown: Westlaw, Lexis, ChatGPT… or EvenSteven?
- Delay In Federal Disaster Assistance Causing Failure Of Small Business In Disaster Areas
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Kaltra Introduces New Downward-Spraying Distribution Technology to Boost Microchannel Evaporator Performance
- Talentica Announces Winners of Multi-Agent Hackathon 2026
- Special Alert: Undervalued Opportunity: IQSTEL (N A S D A Q: IQST) Positioned for Explosive Multi-Year Growth
- Triple-Digit Growth, Strategic N A S D A Q Uplist, Plus A Scalable Healthcare Rollout Model: Stock Symbol: CDIX
- Vesica Health Receives FDA Breakthrough Device Designation for AssureMDx
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- Lineus Medical's SafeBreak® Vascular Added to Alliant GPO Contract
- Cancun All Inclusive is ready for Spring Break 2026 with new Resorts, Exclusive Deals, activities and more!
- 66% of US Bankruptcies Are Medical — So Americans Are Building Businesses That Cover Healthcare Emergencies
- Ludex Partners With Certified Trading Card Association (CTCA) To Elevate Standards And Innovation In The Trading Card Industry
- Best Book Publishing Company for Aspiring Authors
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
Filed Under: Business
0 Comments
Latest on The PennZone
- A Celebration of Visibility, Voice and Excellence: The 57th NAACP Image Awards Golf Invitational, Presented by Wells Fargo, A PGD Global Production
- TopDogTours Expands Award-Winning Walking Tours in Philadelphia with Immersive Experiences
- Athens in Spring: A Culinary City Break That Rivals Paris and Copenhagen
- ClearSight Therapeutics Signs LOI with Covalent Medical for $60M Multi-Channel OTC Eye Care Partnership
- Jayne Williams Joins Century Fasteners Corp. Sales and Business Development Team
- Lord of the Rings Star Orlando Bloom To Host Special Experience at FAN EXPO Philadelphia
- Rocket Fibre Services Growing Customer Base With netElastic Networking Software
- Cummings Graduate Institute for Behavioral Health Studies Honors New Doctor of Behavioral Health Graduates
- IDpack v4 Launches: A Major Evolution in Cloud-Based ID Card Issuance
- Corey Lakins Set to Launch Glow Your Influence, a Podcast Spotlighting Women Leaders
- CCHR Says Psychiatry's Admission on Antidepressant Withdrawal Comes Far Too Late
- 505 Plumbing, Heating & Cooling Launches in Albuquerque, Bringing a Customer-First Approach to Home Services
- As AI.com Sells For Record $70 Million, Attention Now Turns To ArtificialIntelligence.com
- AOW Event Sponsored By The Stanglwirt Resort a renowned five-star Austrian wellness destination
- Average US gambler spends $210 per month in 2026
- 10X Recruitment Launches Operator-Led Executive Search for Behavioral Health and Legal Leaders
- Integris Composites developing armor for military in Arctic Circle
- Caraline Skincare's Gentle Glow Cleansing Oil Named Finalist for Best Face Cleanser at the 2026 CertClean Clean Beauty Awards
- Workplace safety ideas from the front lines to highlight Applied Ergonomics Conference in Arlington, Texas
- ThoroughCare Appoints New Chief Executive Officer & Chief Growth Officer to Accelerate Expansion