Trending...
- Slotozilla Reports Strong Growth in Q2 2026
- Eric Snyder, President and Chief Executive Officer of Keystone Consulting Engineers Named to LVB 300
- LCC Asia Pacific Sponsors CubeSatPlus 2026 at UNSW Sydney
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Nearly One-Third of CRE Asset Managers Make Major Capital Decisions on Gut Instinct, New Survey Finds
- RemoteBridge Names Dr. John N. Just, Ed.D. Chief Executive Officer
- Project CIVICA Report Finds 10,680 Non-Citizen Indicators on New York Voter Rolls — Including 88 Records with Recent Voting History
- New Analysis Details Three Converging Forces in AI and Workforce Policy Behind a $37 Billion GDP Reduction
- Grace Montessori School Earns Prestigious American Montessori Society Accreditation
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- Revenue Optics Launches Pricing and Revenue Growth Management Practice, Names Shafohi Alamgir Vice President
- Popular AI planner Voiset launches version 2.0 and enters MENA at LEAP 2026 with full Arabic support
- CasaPerks and CredHub Partner to Help the Multifamily Industry Strengthen Resident Activation Through Credit-Building Rewards
- NaturismRE expands international research programme with Health & Wellbeing Survey
- L2 Aviation and Gotonomi Extend UAV Connectivity Beyond Cellular Reach
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
0 Comments
Latest on The PennZone
- Real Estate Syndication Attorney Tilden Moschetti Releases The Real Estate Private Equity Blueprint
- 5X Gross Margin Improvement to Beat EPS Consensus; $54.6 Million 10-Year Contract Award Puts Cybersecurity Leader on Path to a $30 Million Run Rate
- Tina Hasselbusch, Turnstone Creative Co-founder and Chief Executive Officer, Named to LVB 300
- Pittsburgh Family Law Attorneys at Pollock Begg Earn Top Honors in 2027 Best Lawyers Guide
- Independent Colbert Packaging Thrives Amid Industrywide Consolidation
- Free Commercial Glass Estimating and Code Compliance Tools Launched by Landmark Construction - The Leading Glass Company in Los Angeles
- Tallahassee Million-Dollar Home Sales Rise in 2026 as Median Selling Time More Than Doubles
- Slotozilla Reports Strong Growth in Q2 2026
- Eric Snyder, President and Chief Executive Officer of Keystone Consulting Engineers Named to LVB 300
- Philadelphia's Girls Anthem to Host The Locker Room Experience Pop-Up for Young Women
- Flexible Plan Investments Names Carl Resnick President
- Paula Josephine Sadler Releases "Imagine" on 24th Anniversary of Sobriety
- Ritz-Carlton Residences Houston Generates Strong Early New Construction Sales at 2120 Post Oak Blvd
- No Sugar Baker Continues National Growth with Seattle Market Expansion Across Washington, Idaho, and Alaska
- The Refugee Archive Launches Campaign to Preserve 21 Female-Headed Household Oral Histories in Rebel-Controlled Goma
- Sharon Pinkenson Chosen as Philly Girl Top 40 Winner
- Space Ambitions Expanding as New Testing Builds on NASA Results and Targets MEO, GEO and Next-Generation Orbital Markets: Ascent Solar Technologies
- FDA Path Clears, Manufacturing Ramps Up + $22.3 Million Strengthens the Balance Sheet; Inflection Point for NRx Pharmaceuticals (N A S D A Q: NRXP)
- Charmaine Thompson Turns Pain Into Purpose Through Woman of Power Charmcare
- Buy Retatrutide Research Peptide: Why Reta Is Getting So Much Attention