Trending...
- Omnitronics launches Ecosystem Health Dashboard to enable proactive monitoring across dispatch environments
- UK Financial Ltd Verifies Maya Preferred PRA Circulating Supply, Proving Its Eight-Year Promise of Under 1M Tokens After Chainlink Labs Agreement
- Minus K Technology launches it Educational Giveaway for Universities and Colleges in the USA
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Insurance for Braces Helps Make Treatment More Manageable for Pennsylvania Families
- Black Ribbon Productions Launches With Fearless 2026 Horror Slate
- Actor Dominic Pace Returns to Television and Film
- Opteamix welcomes Girish Ramachandra to its leadership team as Senior Vice President of Client Services
- Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- Bethany Nikitenko Appointed to Philadelphia Trial Lawyers Association Board of Directors
- Why Baton Rouge's Humid Climate Can Contribute to Carpenter Ant Damage — J&J Exterminating Explains How to Protect Your Home
- Meals on Wheels of the Greater Lehigh Valley Awarded $50,000 Grant from Harry C. Trexler Trust
- RPR Promotes Emily Line to Chief Strategy Officer and Janine Sieja to Chief Product Officer
- Kellyn Hosts Fourth Lehigh Valley Lifestyle Medicine Symposium
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
0 Comments
Latest on The PennZone
- HER Patio Productions celebrates one-year Anniversary of "Say Grace"
- Working Musicians Academy Partners with Black Dog Music Partners to Give Musicians Independent, Income-Producing Careers
- Omnitronics launches Ecosystem Health Dashboard to enable proactive monitoring across dispatch environments
- New Research Identifies "The Great Junk Transfer": 49% of Americans Would Rather Inherit Nothing Than Sort Through a Relative's Belongings
- Minus K Technology launches it Educational Giveaway for Universities and Colleges in the USA
- UK Financial Ltd Verifies Maya Preferred PRA Circulating Supply, Proving Its Eight-Year Promise of Under 1M Tokens After Chainlink Labs Agreement
- Anamorphic 3D Only Works on Fixed Screens. Loud! OOH Put It on a Moving Ad Van for Flood Re
- From DJ Booths to Disney: Orlando Author Ryan Tiffin Launches "Chasing Magic"
- Nola Blue Records Announces New Album from Sherman Holmes
- FDA Food Recall Notices After Outbreak Linked to 98 Hospitalizations: Practical Tips for Safer Grocery Shopping
- The 'Tax Squeeze': Betsson's Record Quarter Previews the Economics of Finland's 2027 Casino Market
- Colonial Nissan Helps Multiple Generations of the Community Find Their Next Vehicle
- ImagineX Acquires Payteros to Strengthen Digital Transformation Capabilities
- From Pizza to Playlists: Marty The Pizza Guy Delivers Three Delicious New Songs
- CAPO Supply Launches New Website Serving Western Pennsylvania and Eastern Ohio
- Meals on Wheels of the Greater Lehigh Valley Receives $15,000 PPL Foundation Grant to Expand Access
- Salestrics Introduces PraiseEngine: The AI-Native Review Engine Built to Fix Social Proof
- BTAQ Unveils Easier Photo Upload Capabilities
- K2 Integrity Names Michael Kallabat Global Head of Investigations and Disputes
- WebDrafter Highlights How AI Search Is Reshaping Online Visibility