Trending...
- UVIFY Brings Advanced Autonomous Systems Research to IROS 2026 in Pittsburgh
- Badanamu Partners With Moonbug Entertainment In Landmark Distribution Deal
- Ad Leverage Sponsors ServiceTitan Pantheon 2026, Supporting Education and Growth in the Home Services Industry
PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
SOURCE Ansys
Related Links
https://www.ansys.com
/ Key Highlights
- Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and electromigration signoff verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing a foundry-certified advanced semiconductor design for TSMC's 3D-IC advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform (OIP) Partner of the Year awards. Ansys' multiphysics simulation solutions for TSMC's world-class 3nm process and highly sophisticated three-dimensional integrated circuit (3D-IC) advanced packaging technologies help mutual customers speed the design of smartphone, high-performance computing, automotive and Internet of Things systems.
Ansys secured an award in the category of Joint Development of 3nm Design Infrastructure for delivering Ansys® RedHawk-SC™ and Ansys® Totem™. These foundry-certified, state-of-the-art power integrity and electromigration signoff tools were optimized for TSMC's 3nm process technology, enabling customers to satisfy key power, thermal and reliability requirements for cutting-edge applications.
More on The PennZone
- Turnstone Creative Welcomes Giovanni Amodei as Manager of Strategic Growth
- CardsNearby Launches Free Nationwide Directory of Card Shows and Local Card Shops for Collectors
- American Garden Rose Selections™ Announces 2027 Winners
- Crossroads4Hope Launches Blood Cancer Resource Hub
- Wilson Venture Capital to Launch News Organization; Will Name Trevor Wilson CEO
Additionally, Ansys earned an award in the category of Joint Development of 3D-IC Design Productivity Solution for providing Ansys® RedHawk™, Ansys® RedHawk-SC Electrothermal™ and Ansys® RaptorH™. These advanced semiconductor analysis tools were certified for the latest variant of TSMC's high-speed, leading-edge CoWoS® and InFO 3D-IC packaging technologies, empowering customers to simulate and alleviate power and thermal reliability issues and to achieve optimal electrical performance.
"We're pleased to congratulate Ansys as the winner of two 2020 TSMC OIP Partner of the Year awards. These awards are a testament to their delivery of multiphysics simulation solutions that enable customer design success, benefitting from the significant power and performance boost of TSMC's latest and most advanced technologies," said Suk Lee, senior director of Design Infrastructure Management Division at TSMC. "Together, we will continue to overcome customers' design challenges and speed breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation solutions to ensure maximum electronics system performance and reliability for next-generation system-on-chip architectures and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm and 3DIC design solutions reflects our long-time role as a trusted signoff partner for TSMC's latest technologies and Ansys is committed to continuing that tradition, helping TSMC drive development of new silicon systems for highly innovative applications."
More on The PennZone
- NIL Club Data Shows Brands Are Looking Beyond Follower Counts in College Sports
- Georgia's Magical Nights of Lights Bigger and Brighter for 2026
- Bicentennial Occult Outing Alternative History Video Series Launches for Spooky Season
- Harvard Educated Board Certified Endodontist Joins Pearlfection Dentistry
- NYC Banners Delivers High-Stakes UN General Assembly Backdrop for the US Department of State Event
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS–T
/ Contacts
| Media | Mary Kate Joyce |
| 724.820.4368 | |
| [email protected] | |
| Investors | Annette N. Arribas, IRC |
| 724.820.3700 | |
| [email protected] |
SOURCE Ansys
Related Links
https://www.ansys.com
0 Comments
Latest on The PennZone
- From Newcomers to Neighbors: LINC Celebrates the People Who Make the Valley Home
- Lehigh Valley's Kellyn Featured in National Film Series Exploring the Future of Diabetes Care
- Top 100 Golf Coach Daniel Guest and Imagen Golf Announce Partnership with Remo Golf at Fairways Golf Club
- DBF Viewer 2000 v9.32 Adds New Control for Data Export
- Badanamu Partners With Moonbug Entertainment In Landmark Distribution Deal
- Exonerated Movers Launches in Philadelphia on International Wrongful Conviction Day
- Atlas Advisors President and Founder Mike McGuire Named a 2026 Leader in Business and Finance by LVB
- Client 1st Financial Founder Michael Fischer Recognized for Building a Relationship-Rooted Career
- Nutriband (N A S D A Q: NTRB): Fighting Back Against the Fentanyl Crisis With a New Approach to Safer Transdermal Medicines
- Curtis Salgado shares a love letter to the city of Chicago and Otis Rush with new single
- Oral statement on the situation of Chairman Lee Man-hee in pretrial detention in the Republic of Korea
- Names Are Not Important Asks What Remains When Identity Is Stripped of Labels
- UVIFY Brings Advanced Autonomous Systems Research to IROS 2026 in Pittsburgh
- Mad Darbarian is available for views as a Horror Host
- Most Utah Deaths Never Reach the Medical Examiner. Postmortem Pathology Offers Salt Lake City a Private Autopsy Option
- Virtually Tour Heritage at South Brunswick's Resort-Style Living - Experience Indoor and Outdoor Amenities at Your Fingertips
- Derek Cook's Roofing Encourages Homeowners to Prepare for Fall Weather
- Boston Industrial Solutions Expands Product Offering with Pad Printing Pads and Silicone for Custom Pad Manufacturing
- Rodeo FX Originals Appoints Yvann Thibaudeau Head of Development & IP
- Phoenix 5/7 Emerges as a Genre-Fluid Artist Collective